Functional Plating Chemicals

Name	Characteristic
Electroforming Nickel	Internal stress for plating during the removal of electroforming.
Dry Ink Removal	Quickly removing dry ink and applicable for use by fine circuits

Products for PWBs

Name	Characteristic
Acid Cleanser	Removing the oxidation on the copper surface and the dry ink residue.
Conditioner	Adjusting the circuit board holes and enhance the hole adhesiveness.
Activator (Micro Etching )	Activating the copper on the circuit board.
Catalyst	Low-concentration Pd(palladium) catalyst, applicable to multilayer board hold plating.
Electroless Nickel	Applicable to SMT and BGA substrate.
Immersion Gold	Cyanide free, and excellent gold wire bonding and tin dipping performance.
Desmear Degreaser	Removing residual glue from IC package in low temperature.
Neutral Nickel	pH neutrality without damaging any electric nickel plating liquid with ceramic base material.
Lead Frame Polisher	Copper and 42 alloy Lead Frame polisher that does not contain chloride and fluoride as well as otherHalogen compound.